Nicholas Jeffries |
SCHOOL: The University of Mississippi
MAJOR: Mechanical Engineer MENTOR: Dr. Tyrus McCarty EXPECTED GRADUATION DATE: May 2003 ORGANIZATIONS & HONORS:
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ABSTRACT
Computer Simulation Of The Thermal Management Of Microchips Via Heat Pipe/Heat Sink Technology
| The trend in packaging electronic systems has been to reduce the size of devices by placing more functions in smaller packages to increase their performance. This has contributed to higher heat densities, requiring that thermal management be given a high priority in the design cycle in order to maintain system performance and reliability. In this study the analysis involved the thermal management of an electronically packaged system associated with a radar subsystem. A computer simulation of the heat transfer in the radar subsystem was performed to test the effectiveness of several specified design conditions. A computational numerical technique was employed to solve the basic equations that governed the physical processes occurring in the radar subsystem. This study focused on the utilization of heat pipe/heat sink technology for cooling the electronic components associated with this subsystem. The results of this study are vital because they provide several effective ways of insuring that the electronic components are operated in a failure-safe environment. |